ECS R&I Calls


Research and innovation on Electronic Components and Systems (ECS R&I) spans a broad range of application areas, complementing the Chips for Europe Initiative and benefiting from its capabilities. ECS activities aim to reinforce the EU’s strategic autonomy in electronic components and systems, supporting future needs of industries and the economy. The ECS R&I calls foster innovation in fields such as artificial intelligence, high-performance computing, cybersecurity, and digital infrastructure.




Open Calls


Global IA call according to SRIA 2025 (first phase)

HORIZON-JU-Chips-2025-IA

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RISC-V Automotive Hardware Platform (first phase)

HORIZON-JU-Chips-2025-IA-FT1

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AI-assisted Methods and Tools for Engineering Automation (first phase)

HORIZON-JU-Chips-2025-IA-FT2

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Global RIA call (first phase)

HORIZON-JU-Chips-2025-RIA

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Heterogeneous integration for high-performance automotive computing

HORIZON-JU-Chips-2025-IA-HPA

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Coming Soon Calls


Boosting R&I cooperation between EU and Japan on semiconductors

HORIZON-JU-Chips-2025-CSA-JPN

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RISC-V Automotive Hardware Platform (second phase)

HORIZON-JU-Chips-2025-IA-FT1

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AI-assisted Methods and Tools for Engineering Automation (second phase)

HORIZON-JU-Chips-2025-IA-FT2

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Global RIA call (second phase)

HORIZON-JU-Chips-2025-RIA

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Global IA call according to SRIA 2025 (second phase)

HORIZON-JU-Chips-2025-IA

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Close Calls


Global IA call according to SRIA 2024

Chips-2024-1-IA-T1

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High Performance RISC-V Automotive Processors supporting SDV

Chips-2024-1-IA-T2

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Service Oriented Framework for the Software Defined Vehicle of the future

Chips-2024-1-IA-T3

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Global RIA call according to SRIA 2024

Chips-2024-2-RIAT-1

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Sustainable and greener manufacturing

Chips-2024-2-RIAT-2

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Joint call with Korea on Heterogeneous integration and neuromorphic computing technologies

Chips-2024-3-RIA

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