Advanced semiconductor devices based on Wide Bandgap materials
  • Call identifier Chips-2023-CPL-4
  • Found in Appendix 2023 Initiative
  • Call Open 1 December 2023
  • Call Closed 29 February 2024


  • Maximum EU Expenditure (M€) 180


    • Call Info


      MAWP Appendix 3
      Click here

      Proposal Submission
      Click here



      Additional Info

        MAWP 2023-2027

        Discover details about the MAWP.

        Click here

        SRIA Introduction

        An introduction and overview of SRIA.

        Click here


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