Our Closed Calls

Chips JU

>
Chips for Europe
Closed Calls

Addressing key objectives such as boosting technological sovereignty, ensuring supply chain resilience, & positioning Europe as a leader in advanced semiconductor technologies.

Pilot line on Advanced sub 2nm leading-edge system on chip technology

Chips 2023 CPL 1

Click here

Pilot line on Advanced Fully Depleted Silicon On Insulator technologies targeting 7nm

Chips 2023 CPL 2

Click here

Pilot line on Advanced Packaging and Heterogenous Integration

Chips 2023 CPL 3

Click here

Pilot line on Advanced semiconductor devices based on Wide Bandgap materials

Chips 2023 CPL 4

Click here

Pilot Line on Advanced Photonic Integrated Circuits

Chips 2023 CPL 5

Click here

Competence Centres

Chips-2024-CCC-1

Click here

Support to the European Network of Chips Competence Centres

Chips-2024-CCC-2

Click here

Design Platform

Chips-2024-CDP-1

Click here
ECS R&I Calls
Closed Calls

The goal is to foster innovation and development in fields such as European artificial intelligence, high-performance computing, cybersecurity, and digital infrastructure.

Joint call with Korea on Heterogeneous integration and neuromorphic computing technologies

Chips 2024-3-RIA

Click here

Global IA call according to SRIA 2024

Chips 2024 1 IA T1

Click here

High Performance RISC-V Automotive Processors supporting SDV

Chips 2024 1 IA T2

Click here

Service Oriented Framework for the Software Defined Vehicle of the future

Chips 2024 1 IA T3

Click here

Global RIA call according to SRIA 2024

Chips 2024 2 RIA T1

Click here

Sustainable and greener manufacturing

Chips 2024 2 RIA T2

Click here